Why Is Fiber-to-Chip Attachment a Challenge?
Fiber-to-chip attachment has long been a pain point in integrated photonics and optical devices. Traditionally, this process contributes 40% of the total cost of a device and leads to significant inefficiencies. On average, 50% of the signal is lost at each connection, significantly impacting performance. Additionally, traditional methods often require specialized fixtures, adhesives, and extended setup times, adding to complexity and expense.
How Does Our Solution Address These Challenges?
Our cutting-edge fiber-to-chip attachment solution is engineered to overcome these longstanding issues, offering 4X efficiency and solving core problems related to cost, time, and performance.
Key benefits include:
<1dB Insertion Loss: Maintain exceptional signal integrity with minimal loss, enhancing overall device functionality.
<1-Second Attachment Time: Accelerate production timelines with a streamlined and efficient attachment process.
What Makes This Solution Cost-Effective and Simple?
Unlike traditional methods, our solution eliminates the need for specialized tools and adhesives:
No Fixtures or Glue Required: Simplify operations and reduce material dependencies.
50% Cost Savings: Dramatically lower device production costs without sacrificing performance or reliability.
Ready to See the Difference?
Our solution redefines efficiency in fiber-to-chip attachment. Watch our product demonstration video at the beginning to discover how this technology can transform your operations.
Transform the way you think about fiber-to-chip attachment—it's time to leave inefficiency behind.
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